Samsung starts mass producing second-gen 10nm RAM

Samsung is now mass-producing the second generation of its 10-nanometer class 8Gb (read gigabit, not gigabyte) DDR4 DRAM, which will be the foundation for its future DDR4 RAM. The new generation of 10nm class RAM is about 10% faster and 15% more efficient than the previous one. The new 8Gb DD4 can operate at 3,600 megabits per second per pin compared to the 3,200 Mbps of the previous generation. All of this means that Samsung has a better base on which it will soon begin production of faster RAM to be used in smartphones, laptops, PCs, smartwatches and all sorts of smart…

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Samsung starts mass production of SoCs based on second generation 10nm FinFET process technology

Samsung announced back in April that its second generation 10-nanometer (nm) FinFET process technology, 10LPP (Low Power Plus), has been qualified and is ready for production. Today the Korean giant has announced that its Foundry Business has started mass production of these SoCs based on second-gen 10nm process tech, 10LPP . This will be used in the Exynos 9 Series … Continue reading “Samsung starts mass production of SoCs based on second generation 10nm FinFET process technology”
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Samsung begins mass production of 10nm LPP chips for early 2018 phones

Samsung Foundry Business has begun mass production of chips built on the second generation 10nm FinFET process. This is a refinement on the current 10nm chips offering up to 10% higher performance or 15% lower power use. The new chips will be ready for early 2018 phones and become more and more available by the end of the year. Qualcomm picked TSMC over Samsung for the Snapdragon 845 so the first 10nm LPP chips out of the factory will likely be Exynos models as well as chipsets like the Snapdragon 670 (10nm LPP). Samsung’s S3 foundry in Hwaseong, Korea Samsung wants to continue…

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Snapdragon 670 rumored to be a 10nm chip with next-gen Kryo cores

The Snapdragon 660 is just barely getting a foothold on the mobile scene but rumors of its successor have started surfacing. Dubbed Snapdragon 670, this chip will allegedly come in early 2018 and be the first of the series to hit 10nm. Even more interesting, the chip will allegedly have an octa-core Kryo CPU – 2 high power cores (Kryo 360) and 6 low-power ones. Note that Kryo 360 would be a third-generation core, while the Snapdragon 835 and 660 use second gen cores (but they are split 4+4 in terms of high and low power). This new processor will use ARM’s DynamIQ tech, which…

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TSMC in mass production of 10nm ‘A11’ chips for Apple’s ‘iPhone 8’

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TSMC is reportedly churning out 10-nanometer "A11" processors for Apple’s "iPhone 8," which is likely to be announced early next month — even if a ship date is still nebulous.
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